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Casa > produtos > Fios de prata revestidos de ouro >
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Bonding Wire

High Bond Strength Gold Plated Silver Wire

Smooth Surface Finish Spooled Wire

Lugar de origem:

CHINA

Marca:

WINNER

Certificação:

ISO9100

Contacte-nos
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High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics
Detalhes do produto
Revestimento:
Ouro
Força de união:
Alto
Certificações:
ISO 9001
Resistência à corrosão:
Alto
Alongamento:
3-20%
Tipo de produto:
Fio de ligação
Acabamento superficial:
Suave, fosco, texturizado
Diâmetro:
0,7-1,0mil
Material:
Ouro, prata
Pureza:
99,99%
Destacar:

High Conductivity Bonding Wire

,

High Bond Strength Gold Plated Silver Wire

,

Smooth Surface Finish Spooled Wire

Termos do pagamento & do transporte
Quantidade de ordem mínima
1000m
Preço
999
Detalhes da embalagem
Rolar, embalagem neutral ou com logotipo OEM
Tempo de entrega
5-8 dias
Termos de pagamento
T/T, D/A, Western Union
Habilidade da fonte
9999999
PRODUTOS CONEXOS
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Bom preço 0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components on-line Vídeo

0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components

Obtenha o melhor preço
Bom preço High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics on-line Vídeo

High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

Obtenha o melhor preço
Contacte-nos
Contato agora
Descrição do produto
High Conductivity Gold Plated Silver Wire on Spool
Factory Supply Ultra Fine Gold Plated Silver Wire
Gold Plated Silver Spooled Wire combines the high conductivity of silver with the corrosion resistance of gold, making it ideal for scientific research and laboratory use. This specialized wire is engineered for demanding applications where signal integrity must be maintained under extreme conditions.
Key Applications
  • Cryogenic systems and superconducting circuits
  • High-frequency RF and microwave assemblies
  • Quantum computing research
  • Particle detection systems
  • Photonics instrumentation
  • Materials science research
  • Aerospace testing applications
  • Precision engineering projects
  • Advanced sensor development
Product Advantages
  • Superior conductivity with low contact resistance
  • Excellent corrosion resistance from gold plating
  • Consistent signal transmission in extreme environments
  • Spooled format for precise handling in clean rooms
  • Ideal for research setups and laboratory applications
Product Images
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 0 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 1 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 2 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 3 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 4 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 5
Etiquetas：

Fios de prata ultrafinos revestidos de ouro

Fios de prata dourados de alta pureza

Fios de prata dourados

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E-mail：sales@winner-sc.com
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A Sichuan WINNER Special Electronic Materials Co., Ltd. concentra-se em fios metálicos ultrafinos revestidos para embalagens de semicondutores.
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